Semiconductor packaging components can be coated to :
Substantially increase the lifespan
Reduce the risk of scratch during maintenance
Improve the releasing capability
Reduce the usage of lubrication oil during the operation
All above benefits can be achieved with careful selection of coating and recipe. Nanofilm has been specialized in this area and to spearhead the development since the company established.
Trim / Form / Singulation (ta-C)
Trims / Forms / Singulation
High temperature deposition (>400C) is not allowed in precision forming die. The dimension of WC will alter slightly. Ti based coatings is not good candidate for this application.
Ti based coatings have high friction coefficient (0.5) as compared to DLC (0.1). Low friction will ensure the operation generates lesser heat and ensure smoother lead surface after forming.
DLC is non sticky to the lead’s surface which typically is plated with Ni alloys. Minimum residue is observed on the DLC coated die compared to TiN coated or uncoated die
Encapsulation (MiCC / CrN/v-HCr)
Encapsulation
Dense and thin film that conforms to any surface finishing.
Good conformity on corners and edges.
Excellent adhesion on tool steel surface.
Low stick property even for Green Compound.
Lesser mold cleaning frequency.
Lower rejects/production scrap due to mold sticking or dirty caviies
Lifespan Comparison
Comparison
Ralated Coating System
Nanofilm offer the following coating systems for production.
FCVA
